Easy with Excel! Thermal Design and Troubleshooting of Electronic Devices
★ Aiming to meet the demands for further heat dissipation in power devices and more! ★ A method for mass production of uniform polyimide microparticles with consistent particle size!
Speaker Mr. Naoki Kunimine, President of Thermal Design Lab, Inc. Target Audience: Personnel involved in heat transfer and heat dissipation related to electronic device design Venue: Kawasaki City Industrial Promotion Hall, 10th Floor, Conference Room 1 [Kanagawa, Kawasaki City] 8-minute walk from JR Kawasaki Station West Exit Date and Time: November 24, 2011 (Thursday) 10:00 AM - 4:30 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company *Limited to Tech-Zone members who apply by November 10. Membership registration is free. *After November 10, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
